기사 (35건)
[Semiconductor]
Samsung to apply MSAP package tech starting with DDR6
Jang Keyoung Yoon | 2022-07-15 16:11
[Semiconductor]
SK Hynix ships 24Gb DDR5 sample
Jang Keyoung Yoon | 2021-12-15 14:08
[Component]
Memory PCB maker TLB to form Vietnam subsidiary
Gijong Lee | 2021-11-10 15:50
[Semiconductor]
Samsung develops first LPDDR5X DRAM
Jang Keyoung Yoon | 2021-11-09 15:47
[Semiconductor]
Samsung applies advanced EUV to ‘14nm’ DRAM
Jang Keyoung Yoon | 2021-10-13 06:59
[Semiconductor]
DDR5 to be 30% more expensive than DDR4
Nari Lee | 2021-09-02 08:20
[Semiconductor]
Samsung to produce 8-layer DDR5 next year
Nari Lee | 2021-08-24 17:55
[Semiconductor]
Samsung introduces in-memory processing to more applications
Jang Keyoung Yoon | 2021-08-24 17:54
[Latest Stories]
SK Hynix posts highest sales and income in 3 years
Nari Lee | 2021-07-27 16:35
[Latest Stories]
SK Hynix applies EUV for the first time in DRAM production
JY Han | 2021-07-12 22:22
[Semiconductor]
Exicon supplies Samsung with DDR5 burn-in tester
Nari Lee | 2021-07-07 19:16
[Semiconductor]
Unitest close to finishing new fab equipment factory
Nari Lee | 2021-07-01 22:03
[Semiconductor]
Samsung begins production of LPDDR5 multichip package
Nari Lee | 2021-06-15 19:47
[Latest Stories]
Samsung launches new power management chips for DDR5
Nari Lee | 2021-05-18 18:20
[Latest Stories]
Samsung develops CXL-based DRAM for data centers
Nari Lee | 2021-05-11 22:41
[Latest Stories]
Samsung develops 512GB DDR5 memory with HKMG applied
Nari Lee | 2021-03-25 20:47
[Latest Stories]
SK Hynix produces 18GB LPPDR5 mobile DRAM
Nari Lee | 2021-03-08 21:50
[Semiconductor]
Samsung’s EUV application reduced DRAM cell size
JY Han | 2021-02-26 07:31
[Semiconductor]
SK Hynix says low-power memory will ease environmental problem
Dongwon Kim | 2021-02-04 08:28
[Semiconductor]
Winpac begins uMCP packaging for SK Hynix
Nari Lee | 2021-01-20 07:01