기사 (53건)
[Semiconductor]
Samsung to apply MSAP package tech starting with DDR6
Jang Keyoung Yoon | 2022-07-15 16:11
Jang Keyoung Yoon | 2022-06-15 17:49
[Semiconductor]
LB Semicon to enter FOWLP space next year
Jang Keyoung Yoon | 2022-06-09 16:38
Jang Keyoung Yoon | 2022-06-07 17:04
Stan Lee | 2022-06-07 11:08
Stan Lee | 2022-05-31 17:19
Stan Lee | 2022-05-31 09:31
Stan Lee | 2022-05-27 08:56
Jang Keyoung Yoon | 2022-05-26 11:39
[Latest Stories]
ISC launches rubber socket for 3D chip packaging
Jang Keyoung Yoon | 2022-05-24 09:25
Stan Lee | 2022-05-18 18:25
[Semiconductor]
APACT to buy ATsemicon’s package business
Jang Keyoung Yoon | 2022-05-16 09:41
[Semiconductor]
Advanced packaging spending to reach US$15 billion this year
Jang Keyoung Yoon | 2022-05-13 16:57
Gijong Lee | 2022-04-28 19:29
[Semiconductor]
ACM Research to build fab equipment factory in South Korea
Jang Keyoung Yoon | 2022-04-26 09:24
[Semiconductor]
Hana Micron developing flexible packaging tech
Jang Keyoung Yoon | 2022-04-07 09:38
Stan Lee | 2022-03-31 15:52
Stan Lee | 2022-03-28 09:34
[Semiconductor]
Exicon supplies SSD testers to Samsung
Jang Keyoung Yoon | 2022-03-21 16:50
[Semiconductor]
Korean OSAT firms see double digit revenue growth in 2021
Jang Keyoung Yoon | 2022-03-15 09:56