기사 (307건) 리스트형 웹진형 타일형 Winpac begins uMCP packaging for SK Hynix Winpac begins uMCP packaging for SK Hynix Auros to reduce reliance on SK Hynix Auros to reduce reliance on SK Hynix Broadcom supplies Wi-Fi 6E chips for Galaxy S21 Ultra Broadcom supplies Wi-Fi 6E chips for Galaxy S21 Ultra Samsung and SK takes 2nd and 3rd place in 2020 semiconductor sales Samsung and SK takes 2nd and 3rd place in 2020 semiconductor sales Intel CEO Swan to step down, VMware CEO Gelsinger to take his place Intel CEO Swan to step down, VMware CEO Gelsinger to take his place NXP showcases Wi-Fi 6, UWB and TSN tech at CES2021 NXP showcases Wi-Fi 6, UWB and TSN tech at CES2021 Intel announces 10nm SuperFin processor Alder Lake at CES 2021 Intel announces 10nm SuperFin processor Alder Lake at CES 2021 AMD launches Zen 3 Ryzen 5000 mobile processor at CES 2021 AMD launches Zen 3 Ryzen 5000 mobile processor at CES 2021 Samsung launches 5nm Exynos 2100 Samsung launches 5nm Exynos 2100 Intel’s Mobileye to launch LiDAR sensor in 2025 Intel’s Mobileye to launch LiDAR sensor in 2025 UMC’s 200mm foundry suffers power outage UMC’s 200mm foundry suffers power outage Japan’s Rohm to begin Chikugo SiC factory operation in 2022 Japan’s Rohm to begin Chikugo SiC factory operation in 2022 처음처음이전이전12345678910다음다음다음끝끝