기사 (193건)
[Component]
Segyung Hightech supplies Galaxy Z Flip
Gijong Lee | 2020-02-17 07:20
[Component]
MCNEX to get boost in FoD sensor biz
Gijong Lee | 2019-10-20 23:19
[Component]
Samsung apologizes for fingerprint security flaw
Gijong Lee | 2019-10-20 23:18
[Semiconductor]
MecaTech Systems supplies test socket for ‘Galaxy S11’
Jong Taek OH | 2019-10-06 11:59
Gijong Lee | 2019-09-17 06:22
[Display Panel]
Samsung to adopt bigger AAD for Galaxy S11
Jong Jun Lee | 2019-09-15 08:55
[Semiconductor]
Samsung to vie with Sony in ToF image sensors
JY HAN | 2019-09-06 11:34
[Semiconductor]
S.Korean chipmakers slashing memory production
JY HAN | 2019-07-30 23:33
Gijong Lee | 2019-07-29 14:18
Gijong Lee | 2019-07-23 09:43
[Semiconductor]
Auros Technology supplies chip TSV overlay equipment
JY HAN | 2019-07-15 13:54
Gijong Lee | 2019-07-07 23:57
[Semiconductor]
[Samsung Investor Forum 2019] EUV to be applied to 1a DRAM
JY HAN | 2019-06-28 05:03
[Semiconductor]
Samsung Electronics Formalizing the Acquisition of Israeli Corephotonics ... securing multi-camera solution
JY HAN | 2019-05-20 10:50
[Semiconductor]
Challenging the Stronghold of Sony ... Samsung image sensor is targeting the No. 1 Market Spot
JY HAN | 2019-05-12 20:41
JY HAN | 2019-04-22 16:29
[Display Panel]
The glass industry is optimistic about "glass being selected as the foldable smartphone cover window material."
Jong Jun Lee | 2019-04-11 10:16
Gijong Lee | 2019-03-18 09:16
Gijong Lee | 2019-03-04 14:29
Gijong Lee | 2019-02-17 10:33