SK Hynix has begun mass production of 16 gigabyte (GB) HBM2E high-speed DRAM, the company said on Thursday.
It will be suitable for super computing and artificial intelligence applications, the company said.
It has a 3.6 gigabits per second (Gbps) per pin with 1024 I/O __ which means it can process around 124 Full HD movies in a second.
SK Hynix vertically stacked eight 16 gigabit (Gb) DRAM chips using through silicon via (TSV) process.
It is 30% smaller and consumes 50% less power compared to existing packaging methods, the company said.
SK Hynix launched launched the chip’ predecessor, HBM2, in August last year which had capacity of 8GB.