UPDATED. 2024-03-29 18:03 (금)
Chip packaging material market to be worth US$20.8 billion in 2024
Chip packaging material market to be worth US$20.8 billion in 2024
  • Jane Lee
  • 승인 2020.07.30 05:46
  • 댓글 0
이 기사를 공유합니다

It will grow 3.4% per year on average
Image: SEMI, TechSearch International
Image: SEMI, TechSearch International

Semiconductor packaging materials market will grow to be worth US$20.8 billion in 2024, according to SEMI and TechSearch International.

The market was worth US$17.6 billion in 2019, but this will grow by an annual average of 3.4% going forward, they said.

Laminate substrate will show the strong growth with an annual average rate of 5% from demand in System-in-Package. Dielectric material used in wafer-level-package will grow by 9% on average per year. Lead frame market will decline however due to packages becoming smaller. Encapsulant will also decline, the pair noted.

5G, artificial intelligence and big data will continue to spur growth in the semiconductor industry, the research firms added.


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr
ND소프트