UPDATED. 2020-09-29 17:37 (화)
Samsung boss visits chip packaging site
Samsung boss visits chip packaging site
  • Stan Lee
  • 승인 2020.07.30 20:29
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It is his 2nd since August last year
Image: Samsung
Image: Samsung

Samsung Electronics vice chairman Lee Jae-yong has visited the company’s Onyang operation at Asan City, where the company develops semiconductor packaging technology on Thursday.

It is his second visit to the site since August of last year.

Lee inspected the progress and mid- to long-term development plan for next-generation semiconductor packaging technology that will be used for artificial intelligence, 5G modem and high bandwidth memory, Samsung said.

The vice chairman asked for innovative new technology from the staff there. He was accompanied by Samsung CEO and vice chairman Kim Ki-nam, who heads the semiconductor business, and other executives.

Samsung must take the lead in the post-COVID-19 era, Lee reportedly said, stressing there was no time to waver. He asked employees to continue to challenge and endlessly innovate.

Semiconductor chips are packaged so that it can transfer signal between each other with electronic devices. Samsung formed the Test & System Package organization to oversee the research of the process. In 2019, Samsung Electronics acquired Samsung Electro-Mechanics’ Panel Level Package business to strengthen its competence further.

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