UPDATED. 2021-11-25 16:28 (목)
Samsung succeeds in 3D stacking for 7nm EUV chip
Samsung succeeds in 3D stacking for 7nm EUV chip
  • Jane Lee
  • 승인 2020.08.14 09:14
  • 댓글 0
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TSV method improves speed, power efficiency 
Image: Samsung
Image: Samsung

Samsung Electronics has succeeded in applying 3D stacking technology on extreme ultraviolet (EUV)-based 7 nanometer (nm) chips, the company said on Thursday.

The technology is called eXtended-Cube, or X-Cube, and stacks the SRAM on top of the logic die.

It uses Samsung’s through silicon via (TSV) technology that uses tiny holes to interconnect layers on chips.

Conventional system semiconductors have the logic dies such as CPU and GPU on the same plane as the SRAM but X-Cube stacks the SRAM on top of the logic dies __ this takes up less space and can save more power, Samsung said.

Data transfer speed is also boosted, Samsung said.

The South Korean tech giant said it will continue to develop new technology to push the boundaries of semiconductor technology.
 


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