[Semicon Korea 2019 Exhibitor]
TSE, a specialist in semiconductor display test interface components, will unveil a new innovative product that combines the strengths of MEMS rubber socket (MRC) and existing pogo pin socket at Semicon Korea 2019 exhibition.
A test socket is a consumable part into which a packaged semiconductor chip is plugged. The rubber socket has a smooth surface compared to a rigid pogo pin and does not damage the semiconductor package. Due to the fast signaling speed and good characteristics, it is mainly used for testing high-speed semiconductors.
TSE is a company with world-class technology in the field of rubber sockets. TSE MRC has solved the short durability problem of conductive powder of existing products by applying MEMS particles to existing rubber sockets. It has minimized the problem of transferring tin.
According to a TSE official, "Due to the miniaturization trend of semiconductor packages, test sockets must also meet the challenges of reacting to fine pitch, improving durability, and responding to high-speed signals. TSE is increasingly leading the market by developing products specialized to such needs.”
Probe cards and test interface boards (TIBs) are also the main source of revenue for TSE.
The probe card is a part for wafer testing for which fabrication has been completed. It carries electrical signals between the ATE (Automatic Testing Equipment) and the wafer. Recently, as a semiconductor die size has been getting smaller, the number of pins mounted on the probe card has greatly increased. TSE has the capability to develop ceramic substrate and probe pins, which are core parts of the probe card, at the MEMS factory. It can respond quickly to the development of so-called 'high pin count' probe cards with many pins. With a probe card platform for all types of ATE, the company can tailor a variety of products to meet customer needs.
The TIB performs electrical functional testing of the final completed memory or non-memory semiconductor package. The TIB must be able to accurately and reliably deliver high-speed signals between the ATE and the semiconductor package without distortion, being located between the ATE and the handler, the transport device.
TSE is a company that has grown through the localization of TIB. The global market share is also at a top level. TSE was able to grow in the TIB market because it quickly responded to customer requests. The density of memory semiconductors is rapidly increasing every year, and the testing time is also rapidly increasing. The speed of operation also increases every year. For this reason, customers often fail to use the expensive ATE that they had previously purchased. TSE TIB can upgrade existing ATE equipment performance through parallel expansion technology, tester-on-board technology, and speed expansion technology. Using TSE TIB, customers can continue to use their existing equipment.
"TIB is vertically integrated from printed circuit board (PCB) design to manufacturing. And TSE TIB products are recognized as 'standard' products in the world," a TSE official said,