LG Electronics’ upcoming dual screen smartphone LG Wing will be powered by Qualcomm’s Snapdragon 765G, TheElec has confirmed.
Snapdragon 765G is an application processor (AP) made using the 7-nanometer (nm) process. It is also the industry’s first 5G modem (Snapdragon X52) and RF system integrated one-chip solution.
Other processors besides the 765 series require the 5G modem to be installed separately.
One-chip solutions allows smartphones makers to make the boards smaller and add features such as larger batteries.
Snapdragon 765G has a max download speed of 2.76Gbps and max upload speed of 464.1Mbps. It supports both sub-6GHz and mmWave spectrum as well as both 5G non-standalone and standalone networks.
It supports FDD which includes TDD and dynamic spectrum sharing (DSS) which allows the chip to work anywhere in the world for 5G roaming. It also supports multi SIM.
Snapdragon 765G boasts 10% better graphics processing performance compared to 765. According to leaked benchmark tests, its graphics processing performance is slightly higher than Samsung Exynos 980 and HiSilicon Kirin 810.
LG Wing is expected to use an OLED panel for its main screen and LCD panel for its secondary screen. The main screen can rotated 90 degrees which reveals the secondary screen. LG named the phone Wing as the T-shape that forms when the main screen is rotated resembles the shape of wings.
The phone will have a triple camera on its back and a pop-up front camera.
Price of LG Wing in South Korea will be around a million won. The company is expected to unveil the phone on September 14. It is offering some customers free 4-week try out for the phone.