[Semicon Korea 2019 Exhibitor]
Pall Corporation will showcase chemical filter devices used in various semiconductor processes at Semicon Korea 2019.
Because the chemical material directly touches the wafer, a yield decrease is inevitable if it is contained in the particles. The filter device of Pall filters the particles contained in the chemical. It is a necessary part of miniaturization of the process.
Currently, DRAM is under the 20nm process and logic is under the 10nm process node in mass production. In this case, the fatal particle size that affects chip characteristics is less than 5 nanometers. While the particle size to be filtered out becomes smaller, the productivity must be improved due to the introduction of extreme ultraviolet (EUV) processes, advancement of individual unit processes, the introduction of new materials, and increase in the number of chemical mechanical polishing (CMP) process steps.
It takes more time to filter out fine particles. The Pall’s product group is recognized for its ability to rapidly filter out finer particles.
Pall will exhibit Ultipleat G2 SP DR 2 nano (nm), a state-of-the-art filter for the cleaning process, and PhotoKleen NTD filter for Negative Tone Developer, of which process numbers are continuously increasing. Both have high initial cleanliness and particle removal performance. It takes less time to exchange the filter. The Profile III filter used for slurry separation filtration in the CMP process satisfied both filtration efficiency and productivity through media layout and differential pressure suitable for the latest slurry.
Pall is an American company with more than 70 years of experience in this field. The annual sales amount to about 3 trillion won. In 1991, the company entered the domestic market in Korea and supply filter devices to major semiconductor manufacturers.
"We are offering innovative filter products that improve the quality control of our customers' products," explained Ji-Ho Jun, CEO of Pall Korea.