Linkflow and Qualcomm will collaborate on next-generation camera and related marketing, the companies aid.
Linkflow will use the US chip giant’s system-on-a-chip (SoC) for its next smart camera.
Once the development is complete, the pair will market the product together, they said.
Linkflow CEO Keven Kim said it will expand its presence in the camera and wearable market, while using Qualcomm’s technology and products for its next-generation camera.
Qualcomm Korea president OH Kwon said the pair will continue to collaborate going forward.
Linkflow has used Qualcomm’s Snapdragon processor for its Camera FITT360 360-degree wearable camera. This product one the innovation award at the Consumer Electronics Show for three years in a row.