UPDATED. 2021-04-12 19:25 (월)
SKC and CJ develop new biodegradable packing material 
SKC and CJ develop new biodegradable packing material 
  • Gijong Lee
  • 승인 2021.04.02 23:03
  • 댓글 0
이 기사를 공유합니다

By combining PLA and PHA
Image: SKC
Image: SKC

SKC and CJ CheilJedang said on Friday that they have developed a biodegradable packing material that is transparent, flexible and durable.

SKC extracted poly lactic acid (PLA) from corns and combined it with CJ’s polyhydroxy alkanoate (PHA) for material, which has the benefits of both materials, the companies said.

CJ will use the new packing material for its tofu product. The company said this will reduce the its use of oil-based plastic by 50 metric tonnes per year.

PHA is biodegradable in both land and sea. CJ’s PHA is both transparent and soft. It received the biodegradable certificate for TUV in February. However, it being soft mean it couldn’t be used as packing material on its own.

SKC received the PHA from CJ and used biaxial stretching method to make the new packing material.

The pair plans to use the new material for other products as well.

CJ will build a PHA production facility with a capacity of 5,000 metric tonnes per year in Indonesia this year. 

SKC will supply the new material to other customers going forward. It is planning to commercialize polybutylene adipate co teraphthalate (PBAT). In 2018, SKC has supplied its biodegradable PLA film packing material to Starbucks Korea.


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2021 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr
ND소프트