UPDATED. 2021-10-15 17:22 (금)
Samsung begins production of LPDDR5 multichip package 
Samsung begins production of LPDDR5 multichip package 
  • Nari Lee
  • 승인 2021.06.15 19:47
  • 댓글 0
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Integrates DRAM and NAND
Image: Samsung
Image: Samsung

Samsung said on Tuesday that it has begun mass production of its LPDDR5 UFS-based multichip package (uMCP).

The package integrates LPDDR5 DRAM with UFS 3.1 NAND flash.

The high spec is for flagship 5G smartphones, Samsung said. The LPDDR5 mobile DRAM offers 25GB/s read and write team, which is 1.5 times faster than LPDDR4X, the company said, while UFS 3.1 offers 3GB/s, double the speed of UFS 2.2.

Samsung plans to offer DRAM in 6GB to 12GB storage options and the NAND flash in 128GB and 512GB.

The package is sized 11.5mm by 13mm, and will offer design freedom in smartphones, the tech giant added.


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