Samsung on Tuesday introduced its latest progresses in processing-in-memory technology at chip conference Hot Chips 33.
The company said it successfully integrated a PIM-enabled high bandwidth memory, also known as HBM-PIM, into a commercialized accelerator system.
It also applied PIM to DRAM modules and mobile memory products, Samsung said.
It applied HBM-PIM to Xilinx’s Virtex Ultrascale Plus AI accelerator in testing.
Samsung said this increased system performance by 2.5 times and reduced power consumption by 60%.
The company also introduced its technology to put processing inside a DRAM module called acceleration DIMM, or AXDIMM.
An AI engine is built inside the buffer chip and AXDIMM can perform parallel processing of multiple sets of DRAM chips instead of one at a time.
The technology can offer twice the performance in AI-based recommencation applications while dropping power use in the system by 40%, Samsung claimed.
Samsung’s LPDDR5-PIM mobile memory technology will also provide independent AI capabilities to mobile devices without the need to be connected to a data center, the company said.
The company will work with other industries to complete the standardization of the PIM platform by the first half of 2022, it added.