UPDATED. 2021-12-03 14:31 (금)
Samsung develops new 2.5D chip packaging solution for HBMs
Samsung develops new 2.5D chip packaging solution for HBMs
  • Jang Keyoung Yoon
  • 승인 2021.11.11 16:56
  • 댓글 0
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Image: Samsung
Image: Samsung

Samsung said on Thursday that it has developed a new chip packaging technology.

Called H-Cube and developed together with Amkor Technology and Samsung Electro-Mechanics, the 2.5 dimension packaging technology can house logic chips and high bandwidth memories (HBM) on a silicon interposer, the tech giant said.

2.5D packaging connects chips vertically and the silicon interposer increases data transfer speed.

It can house over six HBMs and is aimed at high-performance computing and data center applications, Samsung said.
 
Samsung said it narrowed the solder ball width by 35% to minimize the size of the package.

The company launched its first 2.5D packaging solution in 2018.


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