Samsung was planning to turn its task force for high bandwidth memory (HBM) into a permanent office under the chip division, TheElec has learned.
The president of Samsung’s Memory Business, Lee Jung-bae, recently ordered the formation of such an office, sources said.
If the task force is converted to such an office, the office will comprise teams overseeing design, solution, and others that are solely focused on developing HBMs, they said, which can help early efforts to stabilize yield rates.
The formation of such an office reflects Samsung’s anxiety over the competition over HBM among memory chip companies.
SK Hynix has far led the market for HBM3, which is in high demand due to its application in AI. Samsung’s HBM task force was formed in response to this by the order of Kyung Kye-hyun, Samsung’s CEO of its chip division.
Turning this force into a permanent office means it wants to take the lead in HBM3E, an area Samsung is ahead of SK Hynix and Micron.
Micron also recently launched its own HBM3E, which has eight stacks; Samsung on the same day of this announcement unveiled its 12-stack HBM3E.
