SK Materials Airplus said on Monday that it will spend 700 billion won to build plants to produce gaseous nitrogen (GN2) and clean dry air (CDA).The two gases are used in chip production. GN2 is used a carrier gas to transport precursors on the wafers during deposition. It is also used to prevent ox

Samsung shared in a recent paper that it believes hybrid bonding was needed to manufacture a 16-stack high-bandwidth memory (HBM).In its paper published during the 2024 IEEE 74th Electronic Components and Technology Conference held in Colorado last month titled, in Korean, D2W (die to wafer) Copper

The global semiconductor market is expected to grow 16% on-year this year, according to analyst firm World Semiconductor Trade Statistics (WSTS).The market will grow to be worth US$611.2 billion this year, WSTS noted. Its growth projection also increased from the 13.1% it gave late last year.Demand

Nvidia has unveiled its next-generation AI platform dubbed Rubin, a successor to Blackwell that will launch in 2026.The company will also launch a new CPU platform dubbed Vera the same year, Nvidia CEO Jensen Huang said in a keynote address at National Taiwan University.Huang didn’t share the specs

Hanwha Precision Machinery has won a deal with SK Hynix to supply thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM), TheElec has learned.With ASMPT (which Dutch equipment maker ASM is the largest shareholder with a 25% share) also agreeing to develop TC bonder un

PSK Holdings had supplied reflow equipment to Micron back in March, TheElec has learned.The equipment is used in the production of high-bandwidth memory (HBM), which are used with AI processors.The equipment were supplied to Taiwan and Micron is expected to order more if the initial units are receiv

SK Hynix is planning to use Inpria’s metal oxide resist (MOR) in the production of 10-nanometer (nm) Gen 6 (1c) DRAM, TheElec has learned.The resist is expected to be used by the chipmaker to draw the finest lines on the 1c DRAM. Sources said SK Hynix’s 1c DRAM has five extreme ultraviolet (EUV) lay

South Korea will provide expanded financial support to local chip companies to bolster the domestic semiconductor value chain.South Korean President Yoon Suk Yeol said during a meeting held at the Yongsan Presidential Office on Thursday that the government has come up with a program to foster the lo

Samsung’s semiconductor business unit had a difficult time for the past year.The unit, called the Device Solutions (DS) division, recorded 15 trillion won in operating loss last year, its worst performance ever.This contrasted with its performance in the prior years, where it would earn 30 trillion

SK Hynix saw another jump in customer deposits in the first quarter of 2024, the company’s regulatory filings showed.The company said it received 56.1 billion won in advanced payment and 2.7459 trillion won in customer liabilities, or customer deposits where an entity receives advanced payment for o

SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee

CGP Materials is aiming to reach 150 billion won in annual revenue by 2027 through the expansion of its semiconductor patterning material business.The electronic material firm said on Thursday that it has started construction of a new factory in Sejong City.CGP Materials CEO Park Chun-geun said duri

SK Hynix said on Thursday that it has developed Zoned UFS (ZUFS) 4.0 and start mass production of the mobile NAND solution in the third quarter.ZUFS improves on conventional UFS flash memory with increased data management efficiency.It manages data per their characteristics and saves them in differe

Intel has secured the majority of high-NA extreme ultraviolet (EUV) equipment that ASML is manufacturing up to the first half of next year, TheElec has learned,The Dutch fab equipment maker is manufacturing five units of the kit this year, which will all go to the US chipmaker, sources said.As ASML’

Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration

SK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp

SK Hynix is testing the performance of Tokyo Electron’s cryogenic etching equipment, TheElec has learned.The South Korean memory chipmaker has sent test wafers to the fab equipment maker for the tests instead of installing them in its own fab, sources said.Tokyo Electron’s new kit etches at high spe

SK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi

Samsung said on Tuesday that it has begun mass production of 1Tb triple-level cell (TLC) Gen 9 V-NAND.The chip has a double stack structure, which is in contrast to rival SK Hynix’s Gen 9 V-NAND which is expected to have a triple stack structure.This means Samsung will have an advantage in cost whil

SK Hynix is planning to use TSMC’s base die technology for its next-generation high bandwidth memory (HBM).The South Korean memory maker used its own process to make the base die for its latest HBM3E.For the follow-up HBM4, which will start mass production in 2026, SK Hynix will use TSMC’s advanced