Micron said its high-bandwidth memory (HBM) production capacity has been sold out up to 2025.Previously, SK Hynix also said it sold out its HBM production capacity up to next year.Micron said it recorded US$6.811 billion in revenue in its latest fiscal quarter running from March to May, an increase

Back-end equipment maker ASMPT has supplied a demo thermal compression (TC) bonder for high-bandwidth memory (HBM) production to Micron, TheElec has learned.The equipment maker is collaborating with the US memory giant in co-developing a TC bonder for use in HBM4 production.ASMPT has also supplied T

This week, multiple acquaintances messaged me to ask whether a certain report was true.The report, made in South Korean media, claimed that Nvidia asked Samsung to change the design of their high-bandwidth memory (HBM) and that this would cause further delays in supply. Coincidentally, Samsung’s sha

South Korean memory chipmakers Samsung and SK Hynix are expected to spply hybrid bonding in their upcoming 3D DRAM.SK Hynix said during the International Memory Workshop 2024 conference held in Seoul last week that it will apply wafer bonding in its 3D DRAM production.Wafer bonding is also called hy

South Korean AI chip companies Sapeon and Rebellions seeking a merger to become more competitive as competition heats up among AI chip companies amid the boom.The pair said on Wednesday that the merged entity will be inaugurated within the year after they sign the merger deal within the third quarte

SK Materials Airplus said on Monday that it will spend 700 billion won to build plants to produce gaseous nitrogen (GN2) and clean dry air (CDA).The two gases are used in chip production. GN2 is used a carrier gas to transport precursors on the wafers during deposition. It is also used to prevent ox

Samsung shared in a recent paper that it believes hybrid bonding was needed to manufacture a 16-stack high-bandwidth memory (HBM).In its paper published during the 2024 IEEE 74th Electronic Components and Technology Conference held in Colorado last month titled, in Korean, D2W (die to wafer) Copper

The global semiconductor market is expected to grow 16% on-year this year, according to analyst firm World Semiconductor Trade Statistics (WSTS).The market will grow to be worth US$611.2 billion this year, WSTS noted. Its growth projection also increased from the 13.1% it gave late last year.Demand

Nvidia has unveiled its next-generation AI platform dubbed Rubin, a successor to Blackwell that will launch in 2026.The company will also launch a new CPU platform dubbed Vera the same year, Nvidia CEO Jensen Huang said in a keynote address at National Taiwan University.Huang didn’t share the specs

Hanwha Precision Machinery has won a deal with SK Hynix to supply thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM), TheElec has learned.With ASMPT (which Dutch equipment maker ASM is the largest shareholder with a 25% share) also agreeing to develop TC bonder un

PSK Holdings had supplied reflow equipment to Micron back in March, TheElec has learned.The equipment is used in the production of high-bandwidth memory (HBM), which are used with AI processors.The equipment were supplied to Taiwan and Micron is expected to order more if the initial units are receiv

SK Hynix is planning to use Inpria’s metal oxide resist (MOR) in the production of 10-nanometer (nm) Gen 6 (1c) DRAM, TheElec has learned.The resist is expected to be used by the chipmaker to draw the finest lines on the 1c DRAM. Sources said SK Hynix’s 1c DRAM has five extreme ultraviolet (EUV) lay

South Korea will provide expanded financial support to local chip companies to bolster the domestic semiconductor value chain.South Korean President Yoon Suk Yeol said during a meeting held at the Yongsan Presidential Office on Thursday that the government has come up with a program to foster the lo

Samsung’s semiconductor business unit had a difficult time for the past year.The unit, called the Device Solutions (DS) division, recorded 15 trillion won in operating loss last year, its worst performance ever.This contrasted with its performance in the prior years, where it would earn 30 trillion

SK Hynix saw another jump in customer deposits in the first quarter of 2024, the company’s regulatory filings showed.The company said it received 56.1 billion won in advanced payment and 2.7459 trillion won in customer liabilities, or customer deposits where an entity receives advanced payment for o

SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee

CGP Materials is aiming to reach 150 billion won in annual revenue by 2027 through the expansion of its semiconductor patterning material business.The electronic material firm said on Thursday that it has started construction of a new factory in Sejong City.CGP Materials CEO Park Chun-geun said duri

SK Hynix said on Thursday that it has developed Zoned UFS (ZUFS) 4.0 and start mass production of the mobile NAND solution in the third quarter.ZUFS improves on conventional UFS flash memory with increased data management efficiency.It manages data per their characteristics and saves them in differe

Intel has secured the majority of high-NA extreme ultraviolet (EUV) equipment that ASML is manufacturing up to the first half of next year, TheElec has learned,The Dutch fab equipment maker is manufacturing five units of the kit this year, which will all go to the US chipmaker, sources said.As ASML’

Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration