The global smartphone application processor (AP) sales dropped 26% year over year in the second quarter due to low sales of smartphones caused by the COVID-19 pandemic, according to market research firm CounterPoint.Leader Qualcomm saw its market share drop while Chinese vendors HiSilicon and MediaT

SiFive will unveil a PC based on its RISC-V core at the Linley Fall Processor Conference 2020 on October 27, the company said.SiFive was founded by UC Berkeley professors Krste Asanovic, Andrew Waterman and Yunsup Lee in 2015.The three unveiled RISC-V, an open source CPU instruction set architecture

Qualcomm has launched its high-performance AI inference accelerator Cloud AI 100, the company said.It will also be providing the edge development kit.Cloud AI 100 will provide advanced signal processing and power efficiency to support for AI solutions from data centers, cloud edge, edge appliance an

Xilinx is aiming to expand into 5G network virtualization band market of South Korea.The company unveiled its T1 Telco Accelerator Card via an online conference on Wednesday for the South Korean market.T1 is a micro accelerator card for O-RAN distributed unit (O-DU) and virtual baseband unit (vBBU).

Nextin will challenge KLA in the global semiconductor inspection equipment market, the CEO of the South Korean company said on Thursday.CEO Tae Hoon Park said the company will strengthen its technology to compete with KLA, the US company that dominates in dark-field inspection equipment. In South Ko

Apple has unveiled its 5 nanomter (nm) application processor the A14 Bionic.The chip will power iPad Air unveiled on Wednesday and will likely power the upcoming iPhone 12 series to be unveiled next month.A14 Bionic is Apple’s first AP made with the 5nm process. A13 Bionics launched last year was ba

Electronics and Telecommunications Research Institute (ETRI) and Seoul National University will collaborate on complementary metal oxide semiconductor (CMOS) technology for artificial intelligence (AI) application, the pair said Wednesday.CMOS is used for integrated circuits on memory chips and micr

S&S Tech will launch pellicle for use in silicon-based extreme ultraviolet (EUV) exposure process in semiconductor production, the company said on Wednesday.The company will launch them in the fourth quarter, it said at the 2020 EUVL Supplier Showcase event hosted by Hanyang University’s EUV-IUCC (I

Telechips has chosen Dialog Semiconductor as its power management partner, the company said.Dolphin Plus and Dolphin 3 platforms, application processors for in-vehicle infotainment and digital cockpit, will use Dialog’s power management chips.Telechips will expand application of Dialog’s chips to ne

Microprocessing unit (MPU) market will recover this year, according to IC Insights.MPU includes CPU for PC and servers as well as application processors (AP) such as system-on-a-chip (SoC) used in smartphones.MPU market will grow 1.4% year over year in 2020 to be worth US$79.3 billion.Last year, the

Samsung Electronics and KAIST university has ended their patent lawsuits over FinFET technology.KAIST has claimed that the South Korean tech giant used the patents of its subsidiary KAIST IP without permission.FinFET allows semiconductors to use less power while increasing their performance.The tech

Nvidia has made it official that it plans to acquire Arm for US$40 billion on Sunday.The deal will be the biggest M&A in the semiconductor industry to date. However, the deal is still pending approval from authorities in various countries including China.SoftBank and Vision Fund currently hold a 75%

3D stacking technology will lead the semiconductor packaging market in the next five years, according to research firm Yole Developpement.Advanced semiconductor packaging market was worth US$29 billion in 2019 but this will grow by an average of 6.6% per year to be worth US$42 billion in 2025, the f

LG Electronics’ upcoming dual screen smartphone LG Wing will be powered by Qualcomm’s Snapdragon 765G, TheElec has confirmed.Snapdragon 765G is an application processor (AP) made using the 7-nanometer (nm) process. It is also the industry’s first 5G modem (Snapdragon X52) and RF system integrated on

Intel announced its new 11th generation Intel Core Processor, which was code named Tiger Lake, on Thursday.Computing performance is 10% higher compared to the 10th generation (Ice Lake) and graphic performance has doubled, the chip giant said.HP, Dell, Lenovo and other major PC makers will launch so

DB HiTek said Thursday that it has successfully developed a high-performance microphone based on micro electro mechanical systems (MEMS). The microphone had a signal to noise ratio (SNR) of 65dB, the company said at the online MEMS & Sensor Forum hosted by SEMI.Jung Min-Hyun, a developer at DB HiTek

Broadcom was the number one fabless company in terms of sales in the second quarter, beating Qualcomm, according to market research firm TrendForce.The company had temporarily ceded its top position to Qualcomm in the first quarter.Broadcom saw sales slow due to the trade dispute between US and Chin

KEC has clinched a supply deal with Tesla to provide them with LV MOSFET TVS used in digital cockpits, the company said on Tuesday.Supply for the chips will begin in 2021.They will be used for over-voltage protection and over-current protection on touch screen liquid crystal display (LCD) panels on

Nextin, the semiconductor wafer inspection equipment making subsidiary of APS Holdings, aims to diversify its current revenue stream that is lopsided towards SK Hynix, the company said.The company, which is planning to go public on KOSDAQ in October, said it expected sales from Samsung Electronics a

Samsung Electronics’ second factory at its Pyeongtaek semiconductor plant has begun mass production, the company said.It will produce 3rd generation 10-nanometer (nm) LPDDR5 mobile DRAM using the extreme ultraviolet (EUV) process, Samsung said.The factory, called Pyeongtaek Line 2, is being designed