UPDATED. 2024-06-21 07:30 (금)
EV Group Launches Next-Generation Fusion Wafer Bonding Equipment 'Bond Scale'
EV Group Launches Next-Generation Fusion Wafer Bonding Equipment 'Bond Scale'
  • JY HAN
  • 승인 2019.01.24 11:14
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Presenting new methods to be in charge after Moore's Law
[Semicon Korea 2019 Exhibitor]
EVG bond scale equipment.
EVG bond scale equipment.

EV Group (EVG) announced that, at Semicon Korea 2019, it will introduce 'BONDSCALE', a new type of bonding equipment. Headquartered in Austria, EVG specializes in semiconductor wafer bonding and lithography equipment.

The device can be used in advanced chip manufacturing processes such as M3D (Monolithic 3-Dimension). M3D refers to a method of sequential integration of and stacking of various devices unlike silicon penetrating electrode (TSV) that work on the devices in parallel before combining.

According to the International Devices and System Roadmap (IRDS), written primarily by the International Institute of Electrical and Electronics Engineers (IEEE), production processes such as M3D are expected to become key components of future system semiconductor performance. New forms of semiconductors, beyond complementary metal oxide semiconductor (CMOS) technologies, including backside heat dissipation structures, memory-up techniques on logic chips, and clustered laminates, are expected to leverage M3D-like methods.

EVG said the application of wafer bonding technology to the entire semiconductor process has made it possible to address the performance bottlenecks of logic devices. EVG bond scale equipment incorporates all the necessary technologies for fusion bonding such as cleaning, plasma activation, alignment, pre-bonding and infrared (IR) inspection. Also, the new wafer handling system and optical edge alignment technology are simultaneously applied to enhance the wafer edge alignment during bonding. Thanks to this technology, the new equipment has significantly improved productivity compared to the existing bonding equipment.

“Bond scale equipment has achieved even higher levels of productivity," said Paul Lindner, Chief Technology Officer (CTO) at EVG. “The demands for high performance, low power, and small area requirements for the next-generation logic and memory devices would be possible to achieve for the generations after Moore's Law,” he added.

EVG bond scale equipment has already been shipped to customers.

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