[Semicon Korea 2019 Exhibition]
German optical/optical electronics manufacturer Zeiss is introducing their 3D X-ray imaging solution for semiconductor package failure analysis at Semicon Korea 2019.
3D X-ray is used for failure analysis of various semiconductor packages such as PoP, PLP, Fo-WLP, and etc. It allows you to see if the TSV, interposer, or bump is properly operating through a 3D perspective.
Zeiss’ revealed 3 new types of products: ‘Xradia 600 Series Versa’, ‘Xradia 800 Ultra X-ray Microscope’, and ‘Xradia Context Micro CT.’ Each type of products has different resolution performance. It supports from 950-nano to 50-nano.
Failure analysis of semiconductor package starts with checking errors and analyzing the wiring inside the packages. At this stage, it is more important to find the cause faster rather than showing the screen in high resolution. After this phase, it starts a physical analysis by cutting chips, etc. Through this physical analysis stage, the fundamental cause is found. If you enter this phase, you will need a product with high resolution, even if the process takes longer. Xradia 600 Series Versa supports 100-nano, while Xradia 800 Ultra X-ray Microscope supports 10-nano-resolution.
The Xradia Context Micro CT is designed to correspond to a variety of samples. It has the lowest resolution, but the wide view angle allows you an advantage when looking at large-sized samples. Through an upgrade, it can also show the same level of performance as the Xradia 600 Series Versa
Raj Jammy, the President of Carl Zeiss SMT, said “Korean customers are showing a lot of interest in our new products and it will help boost the sales of Zeiss. In the last three years, Korea has invested a large amount in semiconductor packages and the sales of Zeiss have been rising accordingly.”