UPDATED. 2024-03-28 05:14 (목)
Samsung integrates AI processing into HBM
Samsung integrates AI processing into HBM
  • Nari Lee
  • 승인 2021.02.17 18:30
  • 댓글 0
이 기사를 공유합니다

Called HBM-PIM
Image: Samsung
Image: Samsung

Samsung said on Wednesday that it has developed a high bandwidth memory (HBM) that integrates AI processing.

The company installed AI engines into memory banks of the DRAM to maximize parallel processing.

This effectively shortens the distance data have to travel between the CPU and memory, which leads to increased performance and less power consumption.

Samsung said HBM-PIM has two times the performance of conventional HBM2. Energy consumption drops by over 70%, the company said.

The same HBM interface is used so customers don’t have to install additional software and hardware to use the chip.

Samsung said AI accelerators of its customers was testing HBM-PIM. Test will be wrapped up within the first half of 2021, it said.

The company will present the paper on HBM-PIM at International Solid-State Circuits Conference, which will run up to February 22.

Samsung is currently collaborating with US Argonne National Laboratory's Computing, Environment and Life Sciences arm.
 


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr
ND소프트