Bosch on Monday opened its new 300mm wafer factory in Dresden, after spending 3 years in its construction.
The factory will begin manufacturing chips in September.
It is the German automotive chip giant’s first 30mm wafer fab. It was built in 72,000 meter-square of space and manufacture chips using the 65-nanometer process.
Bosch said it spend 1 billion euros to construct the new fab.
According to market research firm Omdia, Bosch controlled a 4.7% market share in the global auto chip market last year.
Its mainstay in actuators used in car engines and electric power steering system as well as communication chips for communication between modules in the car.
Bosch already makes 150mm and 200mm wafers at a factory in Reutlingen.
The company highlighted that the new fab was highly automated with AI and IoT technologies.