Printed circuit board maker Daeduck Electronics said on Wednesday that it has supplied its first flip chip ball grid array (FC-BGA) to its customer.
The company’s new FC-BGA factory at Ansan went live, the firm said.
FC-BGA is a wireless semiconductor package board. It is used in high-value products such as PC CPU.
Only a few companies manufacture them such as Ibiden, Shinko Denki and Samsung Electro-Mechanics.
Daeduck Electronics said it has build the infrastructure to manufacture FC-BGA for non-memory chips such as those for AI and autonomous driving.
It used modified semi additive process (mSAP) equipment is used previously in its factory for high density interconnectors (HDI) for the new factory the company said.
The firm exited its HDI for smartphone business in the second quarter.
It spent 90 billion won for the new FC-BGA factory starting in July. The company announced an additional 70 billion won in spending for the factory in March.
The firm has previously made around 80 billion won from non-memory chip packages.
But it is now aiming for sales of 300 billion won by 2024.
The company said it plans to secure a production capacity that can handle 1 trillion won in sales after 2022.
