Overlay measurement kit maker Auros Technology said on Monday that it has developed a new package wafer warpage inspection kit that it has supplied a South Korean chip company.
The new kit is called PWWIS-300 and can inspect 12-inch wafers for warpages.
Wafers can warp during fabrication which can cause errors during processes.
There is high demand for warpage inspection for the fan-out package process where the I/O terminals are placed in the outer surfaces of chips.
Auros said development of its latest kit a year and half and the firm was aiming to meet this high demand.
PWWIS-300 can measure wafer warpages in 3D with one image capture. The company said it has high throughput and can measure warpage within a minute per wafer.
The kit can also detect scratches and cracks in 2D. It can also use deep learning to find out which equipment in the fabrication line is causing defects such as scratches, Auros Technology said.
PWWIS-300 will likely be used for through silicon via and wafer bonding processes going forward, the company said.