For system chip packages
Hanmi Semiconductor said on Monday that it has launched a new 12-inch dual-chuck saw used to cut semiconductor packages.
Micro Saw P1121 is the latest in the company’s dual-chuck saw brand Micro Saw.
It launched the 10-inch version called Micro Saw P2101 in June and a 20-inch version for cutting printed circuit boards called Micro Saw P1201.
The new 12-inch version can be used to accommodate various kinds of systems semiconductor packages.
Hanmi Semiconductor offers other fab equipment such as EMI shield, TC bonder, FC bonder and grinders.
The company said it can offer its kits at half of the delivery time of its competitors.
It added that it will continue to meet demands from customers such as TSMC and outsourced assembly and testing companies.
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