Samsung Electro-Mechanics was considering expanding its production capacity for flip-chip ball grid array (FC-BGA), its CEO said on Wednesday.
Company CEO Chang Duck-hyun said during Samsung Electro-Mechanics’ annual shareholders’ meeting that the company was in talks with an unspecified customer to do so.
The company invested around 1 trillion won in its facilities in Vietnam last year to expand FC-BGA production, Chang said.
It has committed another 300 billion won two weeks ago, the CEO said. More details on this will be shared soon, he said.
The CEO also that the company plans to stabilize production at its new package board facility in Vietnam.
In December, Samsung Electro-Mechanics added a sales office in Austin, Texas, where Samsung Electronics has a chip production facility.
Meanwhile, Chang also said the future of package boards will be what he calls system on substrate __ where substrates will become the platform to integrate all systems.
FC-BGA, a high-value chip board, has been in high demand since the start of the Covid-19 pandemic in 2020 due to the subsequent, ongoing global chip shortage.