QRT said on Thursday that it will use its focused ion beam (FIB) technology to offer advanced semiconductor defect analysis.
The company currently offers FIB equipment to offer semiconductor circuit correction service.
This allows chip companies save time and money of mask adjustment and wafer fabrication, QRT said.
The correction is made through etching and deposition. Copper is used the most in microfabrication for the metal lines of the semiconductor. Chips smaller than 65nm conventionally all use copper.
However, use of copper means nonvolatile copper formed from the etching process can be unintentionally redeposited on the surface which can cause short circuit.
QRT said its FIB equipment coupled with its wide data can help avoid this problem. Circuits can be correct from top to bottom and the FIB equipment uses an infrared camera to see through the oxide directly. The machine can handle metal lines as thick as 500nm with a circuit width of 30nm.