Samsung Electro-Mechanics said on Wednesday that it will spend an additional 300 billion won on expanding its flip-chip ball grid array (FC-BGA) production capacity.
This brings the total tally for the company’s spending on FC-BGA since December to 1.9 trillion won.
The additional 300 billion won will be spent on its facilities in Busan and Sejong in South Korea as well its Vietnam factory.
The total 1.9 trillion won in spending is four times the around 500 billion won Samsung Electro-Mechanics earns in revenue per year.
The company also said it aims to become the first South Korean company to manufacture FC-BGA for servers, starting this year.
Sources told TheElec that Samsung Electro-Mechanics is expected to start trial production of server FC-BGA during the third quarter of this year.
