UPDATED. 2024-06-17 07:51 (월)
South Korea passes project to develop advanced chip packaging
South Korea passes project to develop advanced chip packaging
  • JY Han
  • 승인 2024.04.30 09:28
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206.8 billion won earmarked for 7 years
Project to include research on HBM
Image: TheElec
Image: TheElec

A national project to promote the development of advanced technologies in chip packaging has been passed by the South Korean government, TheElec has learned.

It passed the preliminary feasibility review of Korea Institute of S&T Evaluation and Planning, a government think tank to set policies for science and technology development.

The preliminary feasibility review is done on national projects that exceed 50 billion won in value and get over 30 billion won in direct funding from the government.

The review rarely passes on a project in one go but the project on chip packaging was done so, sources said.

The majority of judging members at KISTEP formed a consensus that the project was needed to catch up to leaders in packaging such as Taiwan’s TSMC and the country must become a first mover, they said.

However, the budget was dropped to 206.8 billion won for seven years from the initial proposal of 500 billion won.

With the project passing the preliminary feasibility review, it will be officially announced later this year and commence starting next year.

A source directly involved in the project said the slashing of the budget was expected but what was noteworthy is that it passed the review in one go, which shows that the government was aware of the importance of chip packaging.

The Ministry of Trade, Industry and Energy and the Korea Evaluation Institute of Industrial Technology made the proposal for the project in September last year.

The project itself is subdivided to two parts, the follower part and first mover part, which will be operated separately.

The follower part focuses on the fostering of heterogeneous integration package, wafer-level and panel-level packages, flip-chip technologies __ areas that are already being led by TSMC as well as China’s JCET and Amkor in the US.

The first mover part will spend funding on high-bandwidth memory and other areas where South Korean companies are leading. These include 2.5D package-based HBM, hybrid bonding, 10 to 40-micrometer junction, and others.

It remains to be seen whether glass substrate for chip packaging is included in the project as global chipmakers are upping their spending on ways to replace the plastic core on flip-chip ball grid array with a glass core. Glass is considered more resistant to heat and convenient expand the surface area to house more chips.

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