X-ray equipment maker Xavis is in talks with Samsung to supply its glass board inspection equipment, TheElec has learned.
The kit is used to check whether the copper circuits have properly formed after the through glass via (TGV) process.
Xavis is still developing the equipment and is getting feedback from its potential customer, sources said.
Glass boards are considered the likely successor to be used as the core layer of flip-chip ball grid array (FC-BGA).
Compared to glass fiber reinforced epoxy resin currently used, glasses are less to prone to warpage from heat.
This allows for the formation of finer circuits and larger dies for AI chips.
Xavis recorded 23.4 billion won in revenue in the first half of the year, an increase of 155% year-on-year.
