SK Hynix plans to apply chiplet technology to its memory controller within the next three years to better control cost, a senior executive said.
The memory maker currently uses TSMC as the foundry for its controllers, SK Hynix executive vice president Moon Ki-ill said during a seminar held at Hanyang University.
Within the next two to three years, areas of the controller that require advanced nodes will be made using those nodes while other areas will be using legacy nodes, Moon said, adding the company was developing a technology to connect these separate areas __ that is, chiplet technology.
After TSMC manufactures the controllers for SK Hynix, the memory maker handles the packaging work.
If a chip had functions called A, B, and C, these can be made into separate chips and then reconnected again to have the same performance as they were one integrated chip to begin with, the senior executive said.
In this case, A will use TSMC’s 7nm node for exmaple while B and C will be made with TSMC or other foundry company’s legacy nodes, he said. This allows SK Hynix to better control cost of its DRAM and NAND.
In January, the company filed for a brand name called MOSAIC, which is its chiplet technology.
