German laser company LPKF has denied South Korean counterpart Philoptics’ allegations that disparaged its through glass via (TGV) technology.
Earlier this month, Philoptics claimed that its rival’s technology could only offer one hole size and that its own technology was superior in the fact that it could respond to various hole sizes.
In a letter to TheElec, LPKF said this was not true. The German firm said its equipment offered a drill mode where the holes can be very quickly and smoothly formed, while it also offered a cutting mode that can make various-sized and shaped holes.
Other shapes besides holes, such as align marks or differently sized holes, can be made using this cutting mode, LPKF said.
The company added that it already shipped over 20 units of this equipment and is satisfying various pattern needs of customers.
LPKF also touted its laser-induced deep etching (LIDE) technology where a short laser signal is delivered to where the hole will be on the glass. Then, a high energy photon is delivered to cause structural change __ from density, how chemically bonded the area is, to the crystal structure __ of that area. This allows where the hole will be located to be etched with more ease. This means when the etchant is deposited on the whole surface of the glass, it will react faster on the areas where the laser has been shot, allowing etching to be done quickly and cleanly.
How fast the etching is done can be altered to control the size of the hole __ which is drill mode. In cutting mode, the laser is instead drawn around the area where a shape will be etched.
Philoptics seemed to have been referencing LPKF’s drill mode to claim that its rival can only offer one hole size.
Other companies besides LPKF that offer TGV technology also use etchant to etch holes but don’t use lasers. Without laser induction, these other methods are prone to micro-cracks and the inner surface of the hole may not be smooth, the German company stressed.
LPKF said that its rival’s __ referring to Philoptics __ way of making a physical hole with laser and then expanding that hole using etching/healing is relatively hard to guarantee structural integrity.
LPKF also stressed that it has patents for its technology registered in major countries and that its customers can use its LIDE technology without worrying about patent disputes.
