LG Electronics will offer customized AI chiplets for application in appliances as they are more cost-effective than chips in the market, a senior executive said.
Chips offered by Intel, Qualcomm, and others were general-purpose ones, Jin Gyeong Kim, head of LG Electronics’s SoC Center, said during a conference in South Korean on Wednesday. Removing unnecessary features and making a chip using chiplet technology can halve the price, he said.
Chiplet combines separately made chips through packaging and is considered an alternative and cheaper way to make AI chips instead of packing all the features into one silicon die.
The company’s SoC Center is under the supervision of the CTO and also develops its own IPs.
LG Electronics plans to collaborate in foundry with Samsung, Intel, and TSMC. Kim said it plans to manufacture its AI chiplets, which will be on-device AI chips, using 7- and 5-nanometer process nodes.
Kim said these chips can improve the resolution and sound quality in TVs and increase conveniences in home appliances. The company has finished proof-of-concept for the chips, he added.
Last month, LG Electronics announced its partnership with US chip IP firm Blue Cheetah on chiplet.