Wafer-processing solution provider ACM Research has developed a new suit of cleaning tools dubbed Ultra C, the company announced Wednesday for the South Korean market.
Ultra C b, Ultra C wb and Ultra C s are for backside cleaning, automated wet bench and scrubbing, respectively. They were "semi-critical tools" developed in response to customers' demand for use in additional, less-demanding but important steps in semiconductor production, ACM said.
Ultra C b provides good particle performance and etch uniformity control for three key applications: backside metal removal or RCA clean; backside silicon etching for wet wafer thinning or wet through-silicon via (TSV) reveal; and backside film removal on poly silicon, oxide and nitride layers for wafer recycling, the company said.
Conventional chucks have a likely hood of damaging the front side of wafers. Ultra C b floats the wafer above the chuck without physical contact to avoid this.
Ultra C wb can clean up to 50 wafers at a time. It also has RCA clean,, photoresist removable, oxide etch, silicon nitride removable as well as removable of FOEL oxide or BEOL metal for wafer recycling.
Ultra C s uses the company’s soft brush that offers precise pressure control to remove particles following wafer frontside, bevel and backside cleans of wafers.
Its modular system can be configured with eight chambers for 300mm IC applications __ four each for frontside and backside cleaning.
