SK Hynix to provide HBM3E 16H samples in early 2025 SK Hynix to provide HBM3E 16H samples in early 2025 Ahead of rivals LG Energy Solution CEO expects EV battery market to be difficult through 2026 LG Energy Solution CEO expects EV battery market to be difficult through 2026 Kim also hints at potential investment in India Samsung’s chip business records disappointing profit in Q3 Samsung’s chip business records disappointing profit in Q3 Samsung said on Thursday that it recorde... Samsung SDI sees Q3 profit dip from EV slowdown in Europe Samsung SDI sees Q3 profit dip from EV slowdown in Europe 72.1% year-on-year plunge Chemtronics to start construction of etching factory for Gen 8 OLED Chemtronics to start construction of etching factory for Gen 8 OLED For customer Samsung Display, which supplies displays to Apple
Display Panel Apple mulling over color filter of OLED on its budget MR device Apple mulling over color filter of OLED on its budget MR device Cupertino preferring direct formation on encapsulation Gijong Lee Component PI Advanced Materials develops 4-micrometer polyimide film for smartphones PI Advanced Materials develops 4-micrometer polyimide film for smartphones Gijong Lee BATTERY Battery kit maker MOT expects revenue to exceed 100 billion won this year Battery kit maker MOT expects revenue to exceed 100 billion won this year Company to respond to solid-state, LFP battery demands Stan Lee Component JNTC supplies glass sample to three chip packaging companies JNTC supplies glass sample to three chip packaging companies 510x515mm substrate size Gijong Lee BATTERY LG Energy Solution avoids loss in Q3 thanks to US subsidies LG Energy Solution avoids loss in Q3 thanks to US subsidies Tax credit from IRA saves face Stan Lee Semiconductor Intel aims to ship 100 million units of AI PC processors in 2025 Intel aims to ship 100 million units of AI PC processors in 2025 150% jump from 2024’s goal of 40 million units Seonhaeng Lee Semiconductor SK Hynix posts record profit in Q3 led by HBM SK Hynix posts record profit in Q3 led by HBM HBM sales grew 330%, the company says Seonhaeng Lee Semiconductor Qualcomm adds AI to its new automotive SoCs Qualcomm adds AI to its new automotive SoCs Snapdragon Cockpit Elite and Ride Elite powered by Oryon CPU Stan Lee BATTERY Trafigura CEO to visit Korea Zinc next month Trafigura CEO to visit Korea Zinc next month To meet zinc smelter boss Choi Yun-beom Stan Lee Product Samsung to unveil new foldable on October 21 Samsung to unveil new foldable on October 21 Ihre Yeo BATTERY Samyoung S&C supplies high-performance humidity sensor to Samsung SDI Samyoung S&C supplies high-performance humidity sensor to Samsung SDI For battery maker’s US factory with Stellantis Stan Lee Semiconductor Samsung develops 24Gb GDDR7 DRAM Samsung develops 24Gb GDDR7 DRAM Chip offers 40Gbps speed Ihre Yeo
All News SK Hynix to provide HBM3E 16H samples in early 2025 Apple mulling over color filter of OLED on its budget MR device PI Advanced Materials develops 4-micrometer polyimide film for smartphones LG Energy Solution CEO expects EV battery market to be difficult through 2026 Battery kit maker MOT expects revenue to exceed 100 billion won this year Samsung’s chip business records disappointing profit in Q3 JNTC supplies glass sample to three chip packaging companies Samsung SDI sees Q3 profit dip from EV slowdown in Europe Chemtronics to start construction of etching factory for Gen 8 OLED LG Energy Solution avoids loss in Q3 thanks to US subsidies
TOP 10 1SK Hynix CEO says HBM 3E 12H production on track 2Intel aims to ship 100 million units of AI PC processors by 2025 3Galaxy Z Fold SE’s hinges use double the parts of Fold 6 4Qualcomm adds AI to its new automotive SoCs 5SK Hynix posts record profit in Q3 led by HBM 6LG Electronics records solid third quarter from appliances 7LG Energy Solution CEO expects EV battery market to be difficult through 2026 8Chemtronics to start construction of etching factory for Gen 8 OLED 9LG Energy Solution avoids loss in Q3 thanks to US subsidies 10JNTC supplies glass sample to three chip packaging companies