A total of 19 new fabs will start construction by the end of 2021, according to SEMI.
An additional 10 more fabs are expected to start construction next year, the organization said.
These fabs, when completed, in total will add production capacity equal to 2.6 million 200mm wafers per month, SEMI said.
A total of over US$140 billion will be spend to built these fabs, the organization added.
By 2022, 8 new fabs will start construction at China. Taiwan will also see 8 new fabs start construction. In North America, 6 new fabs will start construction while Japan and South Korea will begin construction of 2 new fabs each.
15 of the new fabs that will start construction in 2021 will be for 300mm wafers. In 2022, 7 of the new fabs being built will be 300mm wafers.
The remaining 7 to start construction by 2022 will be for 100mm, 150mm and 200mm wafers.
Out of the 29 fabs, 15 will for foundry, while 4 will be for memory.
In takes around two years for fabs to be completed with equipment placed in them.
The new fabs will meet increasing demand for chips from telecom, computing, healtcare, online service and automobile sectors, SEMI said.