Fab equipment maker Techwing is planning to enter the machine vision market in the long term, a company spokesperson said on Tuesday.
The company is currently developing its own electric die sorting and burn-in testing kits, which are used in the back-end of wafer fabrication.
Techwing currently offers test handler equipment for memory chips and solid-state drives (SSD).
The company’s aim is to offer a total solution for all kits used in the back-end of wafer fabrication.
Afterward, it plans to complement this with machine vision kits, such as industrial cameras that use image processors and analytic software.
These need to be able to inspect wafers at the micrometer level and take images at high temperatures.
The cameras can be used in the wafer fabrication step where the chips are packaged and sent for testing.