UPDATED. 2024-07-12 07:53 (금)
Hana Micron developing flexible packaging tech
Hana Micron developing flexible packaging tech
  • Jang Keyoung Yoon
  • 승인 2022.04.07 09:38
  • 댓글 0
이 기사를 공유합니다

For wearable and medical devices 
Image: Hana Micron
Image: Hana Micron

Hana Micron has been developing flexible packaging technologies aimed at the use of wearable devices and medical devices.

The project started last year and is being conducted as a five-year plan, a company spokesperson said.

The first result of the project is an ECG sensor module developed late last year aimed at medical patches.

The module allows the sensor to be under 1mA in power and under 5ms in latency, Hana Micron said.

The company applied its existing 3D flexible semiconductor packaging technology on the module for flexibility and reliability of the patches.

The packaging technology allows for semiconductor devices stacked in multiple layers to be bent or flexible.

This makes it optimal for wearable and medical devices that are usually also not rigid.

Hana Micro’s current mainstay is packaging for memory products such as eMMC, eMCP and LPDDR.

It is aiming to expand into packaging for logic chips.

삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr