According to Yole Development
Spending on advanced packaging by chipmakers this year is expected to reach US$15 billion, according to analyst firm Yole Development.
Out of that total, Intel will account for 32% with US$4.75 billion, a significant increase from US$3.5 billion last year.
TSMC meanwhile will account for 27% with US$4 billion, also a jump from US$3.05 billion in 2021.
Intel last year said it plans to build new packaging factories in Malaysia and Italy.
TSMC currently operates four factories in its home country Taiwan and is building a fifth factory and announced it plans to build a sixth one as well.
Samsung, meanwhile, is expected to spend US$1.65 billion this year, accounting for 11% of the total spending, a drop from US$2 billion last year.
The company is putting in new packaging equipment at its Onyang facility.
