Semiconductor testing solution firm ISC said on Monday that it has launched a new rubber socket for 3D chip packaging.
The socket, called iSC-WiDER, is a successor to its socket aimed at CPU and GPU chips.
The latest iteration can also be used to test microcontroller units and for 2.5D and 3D packaging.
More chips are becoming with larger packaging to meet the performance needs of 5G.
The socket also has its operating range increased by 150% and has 30% stronger contact pressure, ISC said.
The company said it aims to increase in share in the market for test sockets aimed at logic chips.