UPDATED. 2024-05-25 06:56 (토)
TC bonder in high demand from HBM and 3D packaging 
TC bonder in high demand from HBM and 3D packaging 
  • Noh Tae Min 기자
  • 승인 2023.09.07 10:07
  • 댓글 0
이 기사를 공유합니다

Chipmakers diversifying suppliers
Image: Semes
Image: Semes

Thermal compression (TC) bonders are in high demand from the launch of high bandwidth memory (Hbm) and 3D packaging by chipmakers.

Accordingly, chipmakers are diversifying their suppliers. Samsung is procuring them from Toray, Shinkawa, and its own subsidiary Semes, sources said.

Meanwhile, SK Hynix is procuring them from Singapore’s ASMPT and domestic firm Hanmi Semiconductor.

TC bonders use thermal compression to bond and stack chips on wafers that have finished processing.

They are used in the production of HBM and 3D packaging which requires lots of bonding during their production.

Japanese companies are major suppliers of the equipment and besides ASMPT of Singapore there is also BESI of the Netherlands.

Most South Korean chipmakers relied on imported bonders but have recently added Semes and Hanmi Semiconductor as their suppliers as well.

However, overseas companies still dominate the bonder market for logic chips.

BESI and ASMPT supply their bonders to TSMC, ASE, and Emkor.

Samsung, thanks to recently securing Nvidia as a packaging customer, is also expanding its spending on securing packaging capacity.

The South Korean tech giant continues to install more bonders at its packaging plant in Onyang, sources said.

삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • 515, Nonhyeon-ro, Gangnam-gu, Seoul, Republic of Korea 4F, Ahsung Bldg.
  • 대표전화 : 82-2-2658-4707
  • 팩스 : 82-2-2659-4707
  • 청소년보호책임자 : Stan LEE
  • 법인명 : The Elec Inc.
  • 제호 : THE ELEC, Korea Electronics Industry Media
  • 등록번호 : 서울, 아05435
  • 등록일 : 2018-10-15
  • 발행일 : 2018-10-15
  • 발행인 : JY HAN
  • 편집인 : JY HAN
  • THE ELEC, Korea Electronics Industry Media Prohibiting unauthorized duplication,publishing,modification and distribution the material on this Site for any purpose.
  • Copyright © 2024 THE ELEC, Korea Electronics Industry Media. All rights reserved. mail to powerusr@thelec.kr