Solus Advanced Materials said on Monday that it has received approval for its thin foils from memory chip giant SK Hynix.
It will be the first case that a domestic copper foil company supplies such a product to SK Hynix.
The thin foils, which are ultra-thin at 2 micrometers, are aimed at use in a modified semi-additive process, a process used in the production of advanced chips.
The supply of thin foils used in chips is dominated by Japan’s Mitsui.
Solus Advanced Materials’ foils use technology from its European leg Volta Energy Solutions.
VES has over 60% market share in high-end copper foil with low loss and high spectrum, according to Solus Advanced Materials, and can make copper foils thinner than 1.5 micrometers.
Solus Advanced Materials will start production of the foils for SK Hynix during the first quarter of next year.
Meanwhile, the foil maker also supplies its ultra-thin foils to another global chip customer. It started production of the foils, which will be on logic chips, in May.