Tech increases number of wafers that can be processed by 125 units
YEST said on Monday that it has developed a new technology that can increase the productivity of the annealing process during wafer fabrication.
A high-pressure annealing equipment that uses the technology can process 125 wafers at one time, up from 75 of previous equipment.
YEST said global chipmakers that were noted of the new technology were showing high interest.
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